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LeapFive Technology participated in the BEYOND EXPO 2023

 

 

 

From May 10th to 12th, 2023, BEYOND Expo 2023 was held in Macau. The expo was hosted by Macao Technology General Association and supported by Trade Development Bureau of Ministry of Commerce, the State-owned Assets Supervision and Administration Commission of the State Council, Center For International Economic and Technological Cooperation, Ministry of Industry and Information Technology, Foreign Environmental Cooperation Center, Ministry of Ecology and Environment of China, China Centre For International Science And Technology Exchange, China International Cooperation Association of Small and Medium Enterprises
Chinese Medical Association, China Academy of Electronic Information Industry Development (CCID), Research and Development International (RDI), CCG China-Asean Grater Bay Area Cooperation Center, and Guangdong Federation of Industry & Commerce.

Under the theme “Technology Redefined,” BEYOND Expo 2023 will focus on the three sub-brands: BEYOND Healthcare, BEYOND Sustainability, and BEYOND ConsumerTech. The expo will encourage exchanges of ideas through exhibitions and industry summits to promote comprehensive industrial upgrade, development, and transformation, for a better global innovation ecology.

 

 

 

 

Guangdong LeapFive Technology Co., Ltd. (referred to as “LeapFive”) was invited by the Hengqin Guangdong-Macau Deep Cooperation Zone Economic Development Bureau and the Zhuhai Advanced Integrated Circuit Research Institute to showcase its latest products at the Consumer Technology Exhibition Area of the Macau Venetian Macao Cotai Expo. LeapFive, known as a pioneering creator of RISC-V architecture embedded processor chips, upholds a philosophy of “technological innovation and independent controllability.” They specialize in chip design for cloud, network, edge, and terminal domains, providing software and hardware system solutions for derivative products. Their business spans various sectors, including smart energy, smart cities, intelligent logistics, and intelligent manufacturing, offering customers specialized, high-quality, and secure products and services.

 

 

On the morning of May 10th, Wei Shaojun, Chairman of China Semiconductor Industry Association IC Design Branch and Professor at Tsinghua University’s Institute of Microelectronics; Ju Long, Vice President of SEMI Global and President of SEMI China; Liao Zhijun, CEO of WiseWave (Zhuhai) Technology Co., Ltd.; and other guests visited the LeapFive booth. Dr. Aglaia Kong, CEO & CTO of LeapFive, warmly welcome the visitors and introduced them to LeapFive’s latest product, the NB2.

 

Mr. Wei Shaojun (middle)

 

Ju Long (second on the left), Liao Zhijun (second on the right)

The NB2 is a high-performance SoC targeting the edge side. It adopts a quad-core RISC-V architecture with a clock frequency of 1.8GHz. The external memory supports DDR4/LPDDR4(x) with a maximum bandwidth of up to 4266MT/s. It integrates various hardware acceleration engines such as GPU, NPU, and audio-video DSP, and adopts advanced process technology. It focuses on achieving a balance between low power consumption and high-speed data processing efficiency.

In addition, Dr. Aglaia Kong was interviewed by Macau Business Daily. She answered questions related to how Chinese companies can enhance their competitiveness in the field of technology amidst the intense international tech competition.

 

 

On the afternoon of May 10th, Dr. Aglaia Kong actively participated in a seminar titled “International Collaboration and Industry-Education Integration for the Development of Guangdong-Macau Integrated Circuits.” The seminar was specifically organized to address the challenges arising from the increasingly complex global geopolitics. The primary focus of the discussion revolved around harnessing the international “window” opportunities presented by Macau and the Hengqin Deep Cooperation Zone. The objective of the seminar was to foster stronger integration among local integrated circuit companies, capital resources, and research institutions with the global market. By actively attracting foreign integrated circuit companies to fully participate in the local market, the aim was to expedite international collaborative development and promote industry-education integration within the integrated circuit industry.